Developing cure kinetics models for interleaf particle toughened epoxies

Show simple item record Kratz, James Mesogitis, Tassos Skordos, Alexandros A. Hamerton, Ian Partridge, Ivana K. 2019-01-07T15:15:54Z 2019-01-07T15:15:54Z 2016-12-31
dc.identifier.citation James Kratz, Tassos Mesogitis, Alex Skordos, et al., Developing cure kinetics models for interleaf particle toughened epoxies. SAMPE 2016, 23-26 May 2016, Long Beach, USA en_UK
dc.identifier.isbn 978-193455123-3
dc.description.abstract In this study, we investigated the cure kinetics behaviour of the commercial Hexply® M21 thermoplastic interleaf epoxy resin system. Dynamic, isothermal, and cure interrupted modulated differential scanning calorimetry (mDSC) tests were used to measure the heat flow of the system, and semi-empirical models were fitted to the data. The cure kinetics model describes the cure rate satisfactorily, under both dynamic heating and isothermal conditions. The glass transition temperature was described using the DiBenedetto equation and showed that heating rate can influence formation of the network; therefore cure schedule must be controlled carefully during processing. en_UK
dc.language.iso en en_UK
dc.publisher Society for the Advancement of Material and Process Engineering (SAMPE) en_UK
dc.rights Attribution-NonCommercial 4.0 International
dc.title Developing cure kinetics models for interleaf particle toughened epoxies en_UK
dc.type Conference paper en_UK

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