Developing cure kinetics models for interleaf particle toughened epoxies

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dc.contributor.authorKratz, James
dc.contributor.authorMesogitis, Tassos
dc.contributor.authorSkordos, Alexandros A.
dc.contributor.authorHamerton, Ian
dc.contributor.authorPartridge, Ivana K.
dc.date.accessioned2019-01-07T15:15:54Z
dc.date.available2019-01-07T15:15:54Z
dc.date.issued2016-12-31
dc.description.abstractIn this study, we investigated the cure kinetics behaviour of the commercial Hexply® M21 thermoplastic interleaf epoxy resin system. Dynamic, isothermal, and cure interrupted modulated differential scanning calorimetry (mDSC) tests were used to measure the heat flow of the system, and semi-empirical models were fitted to the data. The cure kinetics model describes the cure rate satisfactorily, under both dynamic heating and isothermal conditions. The glass transition temperature was described using the DiBenedetto equation and showed that heating rate can influence formation of the network; therefore cure schedule must be controlled carefully during processing.en_UK
dc.identifier.citationJames Kratz, Tassos Mesogitis, Alex Skordos, et al., Developing cure kinetics models for interleaf particle toughened epoxies. SAMPE 2016, 23-26 May 2016, Long Beach, USAen_UK
dc.identifier.isbn978-193455123-3
dc.identifier.urihttps://dspace.lib.cranfield.ac.uk/handle/1826/13791
dc.language.isoenen_UK
dc.publisherSociety for the Advancement of Material and Process Engineering (SAMPE)en_UK
dc.rightsAttribution-NonCommercial 4.0 International
dc.rights.urihttp://creativecommons.org/licenses/by-nc/4.0/
dc.titleDeveloping cure kinetics models for interleaf particle toughened epoxiesen_UK
dc.typeConference paperen_UK

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