Bridging the gap between design and engineering in packaging development

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dc.contributor.authorten Klooster, R.
dc.contributor.authorLutters, D.
dc.contributor.editorRajkumar Roy
dc.contributor.editorEssam Shehab
dc.date.accessioned2009-10-01T09:58:13Z
dc.date.available2009-10-01T09:58:13Z
dc.date.copyright2009
dc.date.issued2009-03-31
dc.descriptionOrganised by: Cranfield Universityen_UK
dc.description.abstractPackaging designers often come up with splendid design proposals, without being aware of technical, marketing or economical restrictions. This leads to infeasible proposals, so many packaging design projects fail. To bridge the gap between design and marketing, a tool has been developed that shows several designs to an extensive community. Designers now have the possibility to get feedback of the target market on the design proposals. In a case study (redesigning a packaging), the tool clearly showed its advantage. This paper discusses the tool, its usage and its contribution to a more effective and efficient development cycle in packaging development.en_UK
dc.description.sponsorshipMori Seiki – The Machine Tool Companyen_UK
dc.identifier.citationR. ten Klooster, D. Lutters, Bridging the gap between design and engineering in packaging development, Proceedings of the 19th CIRP Design Conference – Competitive Design, Cranfield University, 30-31 March 2009, pp383en_UK
dc.identifier.isbn978-0-9557436-4-1
dc.identifier.urihttp://hdl.handle.net/1826/3715
dc.language.isoenen_UK
dc.publisherCranfield University Pressen_UK
dc.relation.ispartofProceedings of the 19th CIRP Design Conference – Competitive Design
dc.rightsCopyright: Cranfield University 2009
dc.subjectPackagingen_UK
dc.subjectUser involvementen_UK
dc.subjectDesignen_UK
dc.subjectManagementen_UK
dc.titleBridging the gap between design and engineering in packaging developmenten_UK
dc.typeConference paperen_UK

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19th CIRP Design Conference – Competitive Design, 2009