Cheap as chips: an accessible chip off acquisition method for ball grid array (BGA) integrated circuits in digital investigations

dc.contributor.authorHadgkiss, Melissa
dc.contributor.authorMorris, Sarah
dc.contributor.authorPaget, Stacey
dc.contributor.authorVentress, Adrian
dc.contributor.authorNorris, Karl
dc.date.accessioned2022-11-17T09:35:11Z
dc.date.available2022-11-17T09:35:11Z
dc.date.issued2022-11-11
dc.description.abstractChip off acquisition has steadily been used in digital investigations as an advanced data acquisition technique. This method has typically been reserved for devices where less invasive methods have been unsuccessful in data recovery. After a review of available literature, limited publications were found to define and discuss a detailed chip off methodology, especially using accessible and low-cost equipment. Therefore, demonstrating a lack of knowledge share and standardisation in this space. This paper creates a methodology for chip off acquisition, that examiners can follow, using an array of equipment. The methodology was developed using accessible resources in a variety of formats and experimental research. Once constructed the method was tested in a collection of scenarios and utilised in research and consultancy. This demonstrated areas where the method was positively implemented and areas where updates could improve the overall success of the methodology. Following the evaluation, a 6-stage process was formulated: deconstruction, identification, removal, restoration, determine and perform.en_UK
dc.identifier.citationHadgkiss M, Morris S, Paget S, et al., (2022) Cheap as chips: an accessible chip off acquisition method for ball grid array (BGA) integrated circuits in digital investigations, Forensic Science International: Digital Investigation, Volume 42-43, October–December 2022, Article number 301481en_UK
dc.identifier.eissn2666-2825
dc.identifier.issn2666-2817
dc.identifier.urihttps://doi.org/10.1016/j.fsidi.2022.301481
dc.identifier.urihttps://dspace.lib.cranfield.ac.uk/handle/1826/18720
dc.language.isoenen_UK
dc.publisherElsevieren_UK
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjectChip off acquisitionen_UK
dc.subjectDigital investigationen_UK
dc.subjectIntegrated circuitsen_UK
dc.titleCheap as chips: an accessible chip off acquisition method for ball grid array (BGA) integrated circuits in digital investigationsen_UK
dc.typeArticleen_UK

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