Surface defects incorporated diamond machining of silicon

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dc.contributor.authorKhatri, Neha
dc.contributor.authorBarkachary, Borad
dc.contributor.authorMuneeswaran, B.
dc.contributor.authorAl-Sayegh, Rajab
dc.contributor.authorLuo, Xichun
dc.contributor.authorSaurav, Goel
dc.date.accessioned2020-08-19T15:08:40Z
dc.date.available2020-08-19T15:08:40Z
dc.date.issued2020-07-31
dc.description.abstractThis paper reports the performance enhancement benefits in diamond turning of the silicon wafer by incorporation of the Surface Defect Machining (SDM) method. The hybrid micromachining methods usually require additional hardware to leverage the added advantage of hybrid technologies such as laser heating, cryogenic cooling, electric pulse or ultrasonic elliptical vibration. The SDM method tested in this paper does not require any such additional baggage and is easy to implement in a sequential micro-machining mode. This paper made use of Raman spectroscopy data, average surface roughness data and imaging data of the cutting chips of silicon for drawing a comparison between conventional Single Point Diamond Turning (SPDT) and SDM while incorporating surface defects in the (i) circumferential and (ii) radial directions. Complimentary 3D Finite Element Analysis (FEA) was performed to analyse the cutting forces and the evolution of residual stress on the machined wafer. It was found that the surface defects generated in the circumferential direction with an interspacing of 1 mm revealed the lowest average surface roughness (Ra) of 3.2 nm as opposed to 8 nm Ra obtained through conventional SPDT using the same cutting parameters. The observation of the Raman spectroscopy performed on the cutting chips showed remnants of phase transformation during the micromachining process in all cases. FEA was used to extract quantifiable information about the residual stress as well as the sub-surface integrity and it was discovered that the grooves made in the circumferential direction gave the best machining performance. The information being reported here is expected to provide an avalanche of opportunities in the SPDT area for low-cost machining solution for a range of other nominal hard, brittle materials such as SiC, ZnSe and GaAs as well as hard steelsen_UK
dc.identifier.citationKhatri N, Barkachary BM, Muneeswaran B, et al., (2020) Surface defects incorporated diamond machining of silicon. International Journal of Extreme Manufacturing, Volume 2, Issue 4, December 2020, Article number 045102en_UK
dc.identifier.issn2631-8644
dc.identifier.urihttps://doi.org/10.1088/2631-7990/abab4a
dc.identifier.urihttps://dspace.lib.cranfield.ac.uk/handle/1826/15706
dc.language.isoenen_UK
dc.publisherIOPen_UK
dc.rightsAttribution 3.0 International*
dc.rights.urihttp://creativecommons.org/licenses/by/3.0/*
dc.subjectSurface Roughnessen_UK
dc.subjectFinite Element Analysis (FEA)en_UK
dc.subjectSiliconen_UK
dc.subjectSurface Defect Machining (SDM)en_UK
dc.titleSurface defects incorporated diamond machining of siliconen_UK
dc.typeArticleen_UK

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