Advances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniques

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dc.contributor.authorChen, Xiaomei
dc.contributor.authorShaw, Christopher
dc.contributor.authorGelman, Len
dc.contributor.authorGrattan, Kenneth T. V.
dc.date.accessioned2019-07-22T15:12:50Z
dc.date.available2019-07-22T15:12:50Z
dc.date.issued2019-03-11
dc.description.abstractIn this paper, recent advances in the minimum-destructive testing of the adhesion of coating-substrate systems are reviewed, focusing on key techniques such as micro- and nano-scale levels of indentation, scratching, laser-induced wave shock, as well as the blister and buckle approach. Along with adhesion failure tests, the latest and most extensive applications of the adhesion test methods in nano-, micro- and bulk-coating technology and the associated techniques to determine the minimum damage defects left on the coatings are discussed and their use reviewed.en_UK
dc.identifier.citationChen X, Shaw C, Gelman L, Grattan KTV. Advances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniques. Measurement, Volume 139, June 2019, pp. 387-402en_UK
dc.identifier.issn0263-2241
dc.identifier.urihttps://doi.org/10.1016/j.measurement.2019.03.026
dc.identifier.urihttps://dspace.lib.cranfield.ac.uk/handle/1826/14371
dc.language.isoenen_UK
dc.publisherElsevieren_UK
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjectInterface adhesionen_UK
dc.subjectBond strengthen_UK
dc.subjectCoating-substrate systemen_UK
dc.subjectMinimum-destructive testingen_UK
dc.titleAdvances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniquesen_UK
dc.typeArticleen_UK

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