Influence of deposition strategies on residual stress in wire + arc additive manufactured titanium Ti-6Al-4V

Wire + arc additive manufacturing (WAAM) is a modern manufacturing process that has opened new possibilities for rapid builds and reductions in material wastage. This paper explores residual stress in WAAM Ti-6Al-4V walls built using three different deposition strategies: single bead, parallel path, and oscillation path. The effect of interlayer hammer peening and interlayer temperature was investigated for the single bead walls. We also examined the residual stress in compact-tension (C(T)) coupons extracted from large builds (walls) with crack orientation either parallel with or perpendicular to the build direction. This type of sample is often used for the measurement of the fatigue crack growth rate. The contour method was used for experimental determinations of residual stress. In addtion, residual stress in the C(T) coupons was estimated by finite element (FE) analysis. A good agreement was achieved between the contour method and FE analysis. The oscillation-path wall had the lowest residual stress values. For the single bead walls built with various process conditions, residual stress was significantly reduced after removing the substrate. A interlayer temperature of 110 °C resulted in much higher residual stress values in the wall (both tensile and compressive) compared to the continuous build, with much higher interlayer temperature.