Inspection of electronic component using pulsed thermography

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dc.contributor.authorTinsley, Lawrence
dc.contributor.authorLiu, Haochen
dc.contributor.authorAddepalli, Sri
dc.contributor.authorLam, Wayne
dc.contributor.authorZhao, Yifan
dc.date.accessioned2021-09-08T09:15:34Z
dc.date.available2021-09-08T09:15:34Z
dc.date.issued2021-07-14
dc.description.abstractCounterfeit electronic components (CEC) are of great concern to governments and industry globally as they could lead to systems and mission failure, malfunctioning of safety critical systems, and reduced reliability of high-hazard assets. Depending on the cost of CEC going into the production line, some industries might look to have some sort of inspection capability in-house to screen critical components before they go to assembly. Although advanced counterfeit inspection methods have been developed for a variety of components, they generally exhibit a combination of disadvantages such as destructive, low throughput, high unit cost, or inaccessible to unskilled operator. This paper investigates the potential of pulsed thermography on detection of CEC in a fast and non-destructive manner. The second derivative of post-heat thermal response is used to construct a fingerprint to differentiate genuine and counterfeit components. Results successfully demonstrate the potential of the proposed solution.en_UK
dc.identifier.citationTinsley L, Liu H, Addepalli P, et al., (2021) Inspection of electronic component using pulsed thermography, Procedia Manufacturing, Volume 49, 2021, pp. 132-138en_UK
dc.identifier.issn2351-9789
dc.identifier.urihttps://doi.org/10.1016/j.promfg.2020.07.008
dc.identifier.urihttps://dspace.lib.cranfield.ac.uk/handle/1826/17066
dc.language.isoenen_UK
dc.publisherElsevieren_UK
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjectCounteifeit detectionen_UK
dc.subjectNDTen_UK
dc.subjectCorrelationen_UK
dc.subjectTSRen_UK
dc.subjectThermal signatureen_UK
dc.titleInspection of electronic component using pulsed thermographyen_UK
dc.typeArticleen_UK

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