Patterned crack-free PZT thick films for micro-electromechanical system applications

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dc.contributor.authorDauchy, Florent-
dc.contributor.authorDorey, Robert A.-
dc.date.accessioned2011-09-08T09:28:01Z
dc.date.available2011-09-08T09:28:01Z
dc.date.issued2007-05-01T00:00:00Z-
dc.description.abstractThe fabrication and structuring of multilayer-thick film piezoelectric (PZT-lead zirconate titanate) structures, using composite sol-gel techniques and wet etching is described. The composite sol-gel technique involves producing a PZT powder/sol composite slurry which when spun down, yields films a few micrometres thick. Repeated layering and infiltration has been used to produce PZT films between 10 and 40 μm thick. Due to the low firing temperature (<720°C), it has also been possible to produce PZT films with embedded thin (ca. 100 nm thick) metal electrodes. The PZT thick films have also been structured using a wet etching technique. Examples of features and cavities with lateral dimensions in the order of tens of micrometres are presented. The ability to fabricate and structure thick functional films with embedded metal electrode structures offers the possibility to create novel micro-device structures suitable for use in micro-electromechanical systems (MEMSen_UK
dc.identifier.citationF. Dauchy, R. A. Dorey, Patterned crack-free PZT thick films for micro-electromechanical system applications, International Journal of Advanced Manufacturing Technology, 2007, Vol.33 No 1-2, pg 86-94-
dc.identifier.issn0268-3768-
dc.identifier.urihttp://dx.doi.org/10.1007/s00170-007-0968-1-
dc.identifier.urihttp://dspace.lib.cranfield.ac.uk/handle/1826/1970
dc.language.isoen_UK-
dc.publisherSpringer Science Business Mediaen_UK
dc.subjectPZTen_UK
dc.subjectMEMSen_UK
dc.subjectPatterningen_UK
dc.titlePatterned crack-free PZT thick films for micro-electromechanical system applicationsen_UK
dc.typeArticle-

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