An analytical model to predict the depth of sub-surface damage for grinding of brittle materials

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dc.contributor.authorYin, Jingfei
dc.contributor.authorBai, Qian
dc.contributor.authorGoel, Saurav
dc.contributor.authorZhou, Ping
dc.contributor.authorZhang, Bi
dc.date.accessioned2021-05-19T13:28:24Z
dc.date.available2021-05-19T13:28:24Z
dc.date.issued2021-05-15
dc.description.abstractThis paper proposes an analytical model for predicting grinding-induced sub-surface damage depth in a silicon wafer. The model integrates the dislocation kinetics for crack initiation and fracture mechanics for crack propagation for the first time. Unlike other conventional models, the proposed model considers the effects of strain rate on damage depth and the dynamically changing metastable phase change properties. The model is verified by grinding experiments and a comparison of theoretical and experimental results shows a good quantitative agreement. It is found that increasing grinding speed and decreasing depth of cut cause a higher strain rate so as to enhance material brittleness, which is favorable to achieving low sub-surface damage. These findings will pave a way towards optimizing the grinding parameters and greatly improving the production efficiency of hard and brittle materialsen_UK
dc.identifier.citationYin J, Bai Q, Goel S, et al., (2021) An analytical model to predict the depth of sub-surface damage for grinding of brittle materials. CIRP Journal of Manufacturing Science and Technology, Volume 33, May 2021, pp. 454-464en_UK
dc.identifier.issn1755-5817
dc.identifier.urihttps://doi.org/10.1016/j.cirpj.2021.03.019
dc.identifier.urihttps://dspace.lib.cranfield.ac.uk/handle/1826/16695
dc.language.isoenen_UK
dc.publisherElsevieren_UK
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjectfracture mechanicsen_UK
dc.subjectdislocationen_UK
dc.subjectsub-surface damageen_UK
dc.subjectanalytical modelen_UK
dc.subjectsiliconen_UK
dc.titleAn analytical model to predict the depth of sub-surface damage for grinding of brittle materialsen_UK
dc.typeArticleen_UK

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