Determination of thermal wave reflection coefficient to better estimate defect depth using pulsed thermography

Date

2017-08-22

Supervisor/s

Journal Title

Journal ISSN

Volume Title

Publisher

Elsevier

Department

Type

Article

ISSN

1350-4495

Format

Free to read from

Citation

Sirikham A, Zhao Y, Mehnen J, Determination of thermal wave reflection coefficient to better estimate defect depth using pulsed thermography, Infrared Physics and Technology, Vol. 86, November 2017, pp. 1-10

Abstract

Thermography is a promising method for detecting subsurface defects, but accurate measurement of defect depth is still a big challenge because thermographic signals are typically corrupted by imaging noise and affected by 3D heat conduction. Existing methods based on numerical models are susceptible to signal noise and methods based on analytical models require rigorous assumptions that usually cannot be satisfied in practical applications. This paper presents a new method to improve the measurement accuracy of subsurface defect depth through determining the thermal wave reflection coefficient directly from observed data that is usually assumed to be pre-known. This target is achieved through introducing a new heat transfer model that includes multiple physical parameters to better describe the observed thermal behaviour in pulsed thermographic inspection. Numerical simulations are used to evaluate the performance of the proposed method against four selected state-of-the-art methods. Results show that the accuracy of depth measurement has been improved up to 10% when noise level is high and thermal wave reflection coefficients is low. The feasibility of the proposed method in real data is also validated through a case study on characterising flat-bottom holes in carbon fibre reinforced polymer (CFRP) laminates which has a wide application in various sectors of industry.

Description

Software Description

Software Language

Github

Keywords

Non-destructive testing (NDT), Least-squares fitting (LSF), Optimisation, 3D heat conduction, Signal-noise-ratio (SNR), composite defects

DOI

Rights

Attribution 4.0 International (CC BY 4.0) You are free to: Share — copy and redistribute the material in any medium or format Adapt — remix, transform, and build upon the material for any purpose, even commercially. The licensor cannot revoke these freedoms as long as you follow the license terms. Under the following terms: Attribution — You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use. Information: No additional restrictions — You may not apply legal terms or technological measures that legally restrict others from doing anything the license permits.

Relationships

Relationships

Supplements

Funder/s