Contact stiffness effects on nanoscale high-speed grinding: A molecular dynamics approach

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dc.contributor.authorPapanikolaou, Michail
dc.date.accessioned2019-08-14T13:06:07Z
dc.date.available2019-08-14T13:06:07Z
dc.date.issued2019-07-04
dc.description.abstractOne of the most important grinding parameters is the real depth of cut which is always lower than its programmed value. This is because in reality abrasive grains of the grinding wheel are not fixed but attached to a bonding material which is deformed during the process. In this study we investigate the effect of the contact stiffness between a single abrasive grain and the workpiece on the depth of cut and the grinding process characteristics via three-dimensional Molecular Dynamics (MD) simulations. Contact stiffness has been modelled by attaching a single trapezoid abrasive grain to a spring in the normal grinding direction. MD experiments have been repeated due to the stochastic nature of the grinding process in favour of statistical accuracy. Various grinding speeds have been considered while the case of a rough abrasive-workpiece interface has been investigated as well using fractal models. Our results indicate that the trajectory followed by the abrasive grain is not a straight line, as in the case of a rigid abrasive, but a curved one, asymptotically converging towards the equilibrium point which corresponds to the selected value of the spring stiffness. This behaviour alongside the grinding velocity and rough abrasive-workpiece interface have been found to affect the grinding forces, friction coefficient, morphology of the ground surface and subsurface temperature. The present MD model has also been proven to be capable of capturing the thermal softening phenomenon at the abrasive-workpiece interface.en_UK
dc.identifier.citationPapanikolaou M, Salonitis K. Contact stiffness effects on nanoscale high-speed grinding: A molecular dynamics approach. Applied Surface Science, Volume 493, 1 November 2019, pp. 212-224en_UK
dc.identifier.cris23869379
dc.identifier.issn0169-4332
dc.identifier.urihttps://doi.org/10.1016/j.apsusc.2019.07.022
dc.identifier.urihttps://dspace.lib.cranfield.ac.uk/handle/1826/14437
dc.language.isoenen_UK
dc.publisherElsevieren_UK
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjectNanoscale grindingen_UK
dc.subjectContact stiffnessen_UK
dc.subjectReal depth of cuten_UK
dc.subjectMolecular dynamicsen_UK
dc.subjectFractal roughnessen_UK
dc.titleContact stiffness effects on nanoscale high-speed grinding: A molecular dynamics approachen_UK
dc.typeArticleen_UK

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