A novel inspection technique for electronic components using thermography (NITECT)

Simple item page
dc.contributor.authorLiu, Haochen
dc.contributor.authorTinsley, Lawrence
dc.contributor.authorLam, Wayne
dc.contributor.authorAddepalli, Sri
dc.contributor.authorLiu, Xiaochen
dc.contributor.authorStarr, Andrew
dc.contributor.authorZhao, Yifan
dc.date.accessioned2020-09-04T10:47:40Z
dc.date.available2020-09-04T10:47:40Z
dc.date.issued2020-09-03
dc.description.abstractUnverified or counterfeited electronic components pose a big threat globally because they could lead to malfunction of safety-critical systems and reduced reliability of high-hazard assets. The current inspection techniques are either expensive or slow, which becomes the bottleneck of large volume inspection. As a complement of the existing inspection capabilities, a pulsed thermography-based screening technique is proposed in this paper using a digital twin methodology. A FEM-based simulation unit is initially developed to simulate the internal structure of electronic components with deviations of multiple physical properties, informed by X-ray data, along with its thermal behaviour under exposure to instantaneous heat. A dedicated physical inspection unit is then integrated to verify the simulation unit and further improve the simulation by taking account of various uncertainties caused by equipment and samples. Principle component analysis is used for feature extraction, and then a set of machine learning-based classifiers are employed for quantitative classification. Evaluation results of 17 chips from different sources successfully demonstrate the effectiveness of the proposed techniqueen_UK
dc.identifier.citationLiu H, Tinsley L, Lam W, et al., (2020) A novel inspection technique for electronic components using thermography (NITECT). Sensors, Volume 20, Issue 17, September 2020, Article number 5013en_UK
dc.identifier.issn1424-8220
dc.identifier.urihttps://doi.org/10.3390/s20175013
dc.identifier.urihttps://dspace.lib.cranfield.ac.uk/handle/1826/15752
dc.language.isoenen_UK
dc.publisherMDPIen_UK
dc.rightsAttribution 4.0 International*
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/*
dc.subjectquantitative classificationen_UK
dc.subjectfeature selectionen_UK
dc.subjectnumerical simulationen_UK
dc.subjectpulsed thermographyen_UK
dc.subjectunverified electronic componentsen_UK
dc.titleA novel inspection technique for electronic components using thermography (NITECT)en_UK
dc.typeArticleen_UK

Files

Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
Novel_Inspection_Technique_For_Components_Using_Thermography-2020.pdf
Size:
3.13 MB
Format:
Adobe Portable Document Format
Description:
Download
License bundle
Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
1.63 KB
Format:
Item-specific license agreed upon to submission
Description:
Download

Collections

Staff publications (SATM)