A process chain for integrating microfluidic interconnection elements by micro- overmoulding of thermoplastic elastomers

dc.contributor.authorAttia, Usama M.-
dc.contributor.authorAlcock, Jeffrey R.-
dc.date.accessioned2011-05-06T23:09:33Z
dc.date.available2011-05-06T23:09:33Z
dc.date.issued2010-04-14T00:00:00Z-
dc.description.abstractThis paper presents a process chain for in-line integration of microfluidic interconnection elements by a variant of micro-injection moulding (mu IM). A SEBS-based thermoplastic elastomer (TPE) was moulded over polymethylmethacrylate (PMMA) to produce a hybrid microfluidic structure with an aspect ratio of 2. The process chain implemented micro-milling for fabricating micro-structured tool inserts, and mu IM and micro-overmoulding was used for replication. A two-plate mould was used for moulding the substrate, whilst a three-plate mould with a replaceable insert was used for TPE overmoulding. The presented application was an interconnect system for a microfluidic device, which enabled direct fitting of standard tubes into microfluidic substrates. A leakage test showed that the interconnection was leak-proof within a range of flow rates between 0.32 and 0.62 ml min(-1).en_UK
dc.identifier.citationU.M. Attia, J.R. Alcock, A process chain for integrating microfluidic interconnection elements by micro- overmoulding of thermoplastic elastomers, Journal of Micromechanics and Microengineering, Volume 20, Issue 5, 2010, Paper Number 055017
dc.identifier.issn0960-1317-
dc.identifier.urihttp://dx.doi.org/10.1088/0960-1317/20/5/055017-
dc.identifier.urihttp://dspace.lib.cranfield.ac.uk/handle/1826/5300
dc.language.isoen_UKen_UK
dc.publisherInstitute of Physics Publishing; 1999en_UK
dc.subjecthybrid microstructures technologies replicationen_UK
dc.titleA process chain for integrating microfluidic interconnection elements by micro- overmoulding of thermoplastic elastomersen_UK
dc.typeArticleen_UK

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