Citation:
A.J. Pickwell, R.A. Dorey, D. Mba. Thick film, acoustic emission sensors for embedded structural health monitoring
systems. 23rd International Congress on Condition Monitoring and Diagnostic Engineering Management (COMADEM). Nara, Japan, 28 June - 2 July 2010. Eds. S. Okumura, T. Kawai, P. Chen, R.B.K.N Rao.
Abstract:
Structural heath monitoring of engineering structures is of growing interest due
to increasedcomplexity of such structures and the ability to schedule
maintenance when it is needed thuspreventing unnecessary work or preventing
failure. One such method for monitoring the structuralhealth of large scale
structures is through the detection of Acoustic Emissions (AE). A novel
thickfilm Acoustic Emission sensor is presented. Piezoelectric thick film AE
sensors were fabricated bycreating and pattering lead zirconate titanate (PZT)
thick films using a powder/sol composite inkdeposition technique in conjunction
with mechanical patterning of the subsequent films. The resultantAE sensors
exhibit a response comparable to commercially available AE sensors. Comparative
resultsbetween the thick film and commercial sensors will be reviewed and
discussed.
