Characterisation of the cold metal transfer (CMT) process and its application for low dilution cladding

Date

2011-03-01T00:00:00Z

Supervisor/s

Journal Title

Journal ISSN

Volume Title

Publisher

Elsevier Science B.V., Amsterdam.

Department

Type

Article

ISSN

0924-0136

Format

Citation

C.G. Pickin, S.W. Williams, M. Lunt, Characterisation of the cold metal transfer (CMT) process and its application for low dilution cladding, Journal of Materials Processing Technology, Volume 211, Issue 3, 1 March 2011, Pages 496–502.

Abstract

The process characteristics of the synergic cold metal transfer (CMT) process have been examined for welding aluminium alloy. Utilising a simple backlighting system and through the arc monitoring the droplet transfer modes were identified. Whilst the modified short circuit mode was evident for the lower parameter range, a two part transfer mode based upon a combination of spray and short circuit transfer was observed for the mid to upper parameter range. The technology was also explored as a cladding process for applying to ternary alloyed (Al–Cu–Mg) aluminium plate. This alloy system is known to be susceptible to solidification cracking when MIG welded using the binary Al-2319 (Al–Cu) filler wire, this being due to the wide element freezing range of the weld resulting from mixing with the base material. Utilising this filler, weld dilution ratios for both CMT and pulsed welding were identified across the examined parameter range. The CMT process exhibited greater control of dilution that enabled deposition of a quasi-binary (Al–Cu) layer exhibiting a less crack susceptible composition. Onto this layer conventional MIG welding could be applied which could potentially eradicate cracking using a binary fil

Description

Software Description

Software Language

Github

Keywords

CMT, Welding, High strength aluminium, Arc characteristics

DOI

Rights

NOTICE: this is the author’s version of a work that was accepted for publication in Journal of Materials Processing Technology. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Journal of Materials Processing Technology, VOL 211, ISSUE 3, (2011) DOI:10.1016/j.jmatprotec.2010.11.005

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