Characterisation and Material Removal Properties of the RAP™ Process

dc.contributor.advisor	Nicholls, J. R.
dc.contributor.advisor	Shore, Paul
dc.contributor.author	O'Brien, William John
dc.date.accessioned	2011-11-07T17:00:45Z
dc.date.available	2011-11-07T17:00:45Z
dc.date.issued	2011
dc.identifier.uri	http://dspace.lib.cranfield.ac.uk/handle/1826/6560
dc.description.abstract	The Reactive Atom Plasma® (RAP) process is a plasma chemical etching process. RAP was developed at RAPT Industries as a process for removing subsurface damage from silicon carbide optics. The process is being investigated at Cranfield University as a novel method for the fine surface correction of large optics, with the aim of shortening the manufacturing period of the next generation of large telescopes. RAP offers material removal rates that are up to 10 times higher than those of ion beam figuring, the current state-of-the-art technique and the convenience in that it can be operated at atmospheric pressure. Cont/d.	en_UK
dc.language.iso	en	en_UK
dc.publisher	Cranfield University	en_UK
dc.rights	© Cranfield University, 2011. All rights reserved. No part of this publication may be reproduced without the written permission of the copyright holder.	en_UK
dc.title	Characterisation and Material Removal Properties of the RAP™ Process	en_UK
dc.type	Thesis or dissertation	en_UK
dc.type.qualificationlevel	Doctoral	en_UK
dc.type.qualificationname	PhD	en_UK