Abstract:
The polishing and lapping of silicon discs at Texas Instruments Ltd.
was investigated by a team of students from Cranfield as a project for the
Spring Term, January/March 1965.
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Unfortunately, the process was not operating during the period available
to the team and therefore detailed measurements could not be obtained.
This report is based on discussions with Texas Instruments, on analysis of
a short film of the main parts of the process and subsequent analyses and
investigations.
Although a detailed and quantitative list of precise recommendations
cannot be made, a number of worthwhile points arise together with some
suggestions for longer term investigation.
The Cranfield team has learnt a great deal from the project, but there
is naturally a sense of frustration at not being able to present a complete
and comprehensive analysis of the process.
