Citation:
U.M. Attia, J.R. Alcock, A process chain for integrating microfluidic interconnection elements by micro-
overmoulding of thermoplastic elastomers, Journal of Micromechanics and Microengineering, Volume 20, Issue 5, 2010, Paper Number 055017
Abstract:
This paper presents a process chain for in-line integration of microfluidic
interconnection elements by a variant of micro-injection moulding (mu IM). A
SEBS-based thermoplastic elastomer (TPE) was moulded over polymethylmethacrylate
(PMMA) to produce a hybrid microfluidic structure with an aspect ratio of 2. The
process chain implemented micro-milling for fabricating micro-structured tool
inserts, and mu IM and micro-overmoulding was used for replication. A two-plate
mould was used for moulding the substrate, whilst a three-plate mould with a
replaceable insert was used for TPE overmoulding. The presented application was
an interconnect system for a microfluidic device, which enabled direct fitting
of standard tubes into microfluidic substrates. A leakage test showed that the
interconnection was leak-proof within a range of flow rates between 0.32 and
0.62 ml min(-1).