Bridging the gap between design and engineering in packaging development

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dc.contributor.author ten Klooster, R.
dc.contributor.author Lutters, D.
dc.contributor.editor Rajkumar Roy
dc.contributor.editor Essam Shehab
dc.date.accessioned 2009-10-01T09:58:13Z
dc.date.available 2009-10-01T09:58:13Z
dc.date.copyright 2009
dc.date.issued 2009-03-31
dc.identifier.citation R. ten Klooster, D. Lutters, Bridging the gap between design and engineering in packaging development, Proceedings of the 19th CIRP Design Conference – Competitive Design, Cranfield University, 30-31 March 2009, pp383 en_UK
dc.identifier.isbn 978-0-9557436-4-1
dc.identifier.uri http://hdl.handle.net/1826/3715
dc.description Organised by: Cranfield University en_UK
dc.description.abstract Packaging designers often come up with splendid design proposals, without being aware of technical, marketing or economical restrictions. This leads to infeasible proposals, so many packaging design projects fail. To bridge the gap between design and marketing, a tool has been developed that shows several designs to an extensive community. Designers now have the possibility to get feedback of the target market on the design proposals. In a case study (redesigning a packaging), the tool clearly showed its advantage. This paper discusses the tool, its usage and its contribution to a more effective and efficient development cycle in packaging development. en_UK
dc.description.sponsorship Mori Seiki – The Machine Tool Company en_UK
dc.language.iso en en_UK
dc.publisher Cranfield University Press en_UK
dc.relation.ispartof Proceedings of the 19th CIRP Design Conference – Competitive Design
dc.rights Copyright: Cranfield University 2009
dc.subject Packaging en_UK
dc.subject User involvement en_UK
dc.subject Design en_UK
dc.subject Management en_UK
dc.title Bridging the gap between design and engineering in packaging development en_UK
dc.type Conference paper en_UK


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