Xiangdong, F.; Sayle, D.C.; Zhong, L.W.; Paras, M.S.; Santora, B.; Sutorik, A.C.; Sayle, T.X.T.; Yi, Y.; Yong, D.; Xudong, W.; Yie-Shein, Her
(2008-05-27)
Ceria (CeO2) nanoparticles are one of the key abrasive materials for chemical-mechanical planarization (CMP) of advanced integrated circuits. However, CeO2 nanoparticles synthesized by all existing techniques are faceted ...